半导体相关专业词汇中英对照表（含缩写）
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Professional English in Semiconductor
Words
| Words | Translation |
|---|---|
| die | 芯片 |
| wafer | 晶圆 |
| substrate | 基板 |
| baseplate | 底板 |
| encapsulation | 封装，塑装 |
| plate | 电镀 |
| epitaxy | 外延Epi |
| bump | 凸点 |
| voids | 空洞microns |
| Lids | 金属罩 |
| etch | 刻蚀 激光刻蚀 laser etching |
| coplanar | 共面 |
| coplanirity | 共面性 |
| mount | 贴装 solderball mount |
| attach | 贴装die attach |
| assembly | 装配 |
| soldering | 焊接 |
| sintering | 烧结 |
| deposition | 沉积 |
| pitch | 间距 |
| Warpage | 翘曲、弯曲 |
| plasma | 等离子体 |
| polyimide | 聚酰亚胺 |
| epoxy | 环氧树脂 |
| silicone gel | 硅胶 |
| mechanism | 机制 |
| corrosion | 腐蚀 |
| alloy | 合金 |
| particle | 粒子 |
| shear strength | 剪切力 |
| Fab | alt. foundry factory |
| Fabless | Fab + Fabless = complete chip flow |
intermetallicsIMs |
金属间化合物 |
| eutectic | 共晶 |
| porosity | 孔隙NANO - micron |
| delamination | 分层 |
| phosphors | 荧光粉 |
| wear-out | 疲劳、磨损 |
| catastrophic failure | 突然失效 |
| empirical | 经验性的 |
| atomic molecular | 原子 分子 |
Abridge
| Abreviation | Full-name | Translation |
|---|---|---|
| SBM | Solder Ball Mount | 焊球贴装 |
| UBM | Under Ball Material | 球下金属 |
| TIM | Thermal Interface Material | 热表面材料 |
| LIS | Lead Inspection | 引脚检测 |
| BGA | Ball Grid Array | 球栅阵列 |
| FcBGA | Flip Chip Ball Grid Array | 倒装球栅阵列 |
| GPU | Graphics Processing Unit | 图形处理单元 |
| ELK | Extreme Low-k Dielectric | 超低介电系数 |
| DBC | Direct Bonded Copper | 覆铜板 substrate |
| DBA | Direct Bonded Aluminum | 覆铝板 substrate |
| DP | Die Preparation | DS Die Sawing |
| PCB | Printed Circuit Board | 印刷电路板 |
| LD | lead | 引脚lead free 不含铅的 |
| TLP | Transient Liquid Phase Bonding | 瞬间液相键合 |
| SLID | Solid Liquid Interdiffusion Bonding | 固液互扩散键合 |
| CTE | Coefficient of Thermal Expansion | 热膨胀系数 |
| ASIC | Application-Specific Integrated Circuit | 专用集成电路 |
| FPGA | Filed Programmable Gate Array | 可编程门阵列 |
| SoC | System on Chip | |
| MEMS | Micro Electronic Mechanical System | 微机电系统 |
| OSAT | Out Sourced Assembly and Test | 外包封测 |
| IDM | Integrated Design Automation | 集成设计自动化 |
| LTJT | Low Temperature Joining Technology | 低温连接技术 |
| RDL | Redistribution Layer | 重构线层 |
| SEM | Scanning Electron Microscope | 扫描电镜 |
| IMS | Insulated Metal Substrate | 绝缘金属基板 |
| DfR | Design for Reliability | 可靠性设计 |
| FE | Finite Element | 有限元 |
| DOE | Design Of Experiment | 实验设计 |
| EMC | Epoxy Molding Compound | 环氧塑膜料 |
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